Bridge device for interfacing a packaged device with a substrate

ABSTRACT

Techniques and mechanisms for facilitating connection between a packaged device and a substrate of another device. In an embodiment, a device—such as a printed circuit board—comprises a substrate and a hardware interface at a first side of the substrate, the hardware interface to couple the device to a package including integrated circuitry. The device is further configured to couple to a bridge device via contacts disposed at a second side of the substrate. An interconnect extends from the hardware interface to one of the contacts at the second side. In another embodiment, coupling the substrate to the bridge device interconnects two of the contacts at the second side to one another via the bridge device, where one or more contacts of the hardware interface (e.g., only a subset of all such contacts) are also interconnected with the bridge device via the second side.

BACKGROUND

1. Technical Field

Embodiments discussed herein relate generally to the field of printedcircuit boards, and more specifically, but not exclusively, tostructures for interconnecting a substrate with a packaged device.

2. Background Art

Integrated circuitry of a system is often disposed in a packaged device,which is usually mounted on a substrate, such as a printed circuitboard, having conductors to provide for connection with the integratedcircuit package. A typical system, for example, includes one or moremicroprocessors, memory, graphics processors and other complexintegrated circuits that are variously packaged and mounted forinterconnection with a printed circuit board or other substrate.Usually, a microelectronics package has a significant number ofconductive routes (for the routing of power/ground and input/outputsignals) between an integrated circuit thereof, such a microprocessor, achipset, a graphics device, a wireless device, a memory device, anapplication specific integrated circuit, or the like, and externalinterconnects used to connect the microelectronics package to externalcomponents, such as motherboards, interposers, printed circuit boards,and the like. Typically, the formation of the significant number ofconductive routes tends to necessitate stringent design rules and theformation of relatively large microelectronic devices.

The microelectronic industry is continually striving to produce everfaster and smaller microelectronic packages for use in various mobileelectronic products, such as portable computers, electronic tablets,cellular phones, digital cameras, and the like. As successivegenerations of integrated circuits continue to scale in size andincrease in data rates, crosstalk, interconnect density and otherassociated problems pose an increasing challenge to operation of apackaged device with circuitry coupled via the substrate of anotherdevice.

BRIEF DESCRIPTION OF THE DRAWINGS

The various embodiments of the present invention are illustrated by wayof example, and not by way of limitation, in the figures of theaccompanying drawings and in which:

FIG. 1 is an exploded view illustrating elements of a system tointerconnect circuit devices according to an embodiment.

FIG. 2 is a flow diagram illustrating elements of a method tointerconnect a substrate and a packaged device according to anembodiment.

FIG. 3A is a cross-sectional view of a system to interconnect circuitdevices according to an embodiment.

FIG. 3B is a top view of a bridge device including interconnectstructures according to an embodiment.

FIGS. 4A, 4B are cross-sectional views of systems each interconnectrespective circuit devices according to a corresponding embodiment.

FIGS. 5A, 5B are top views of printed circuit boards each to couple to arespective packaged device according to a corresponding embodiment.

FIG. 6 illustrates a computing device in accordance with one embodiment.

FIG. 7 illustrates a block diagram of an exemplary computer system, inaccordance with an embodiment.

FIG. 8 is an interposer implementing one or more embodiments.

FIG. 9 is a computing device built in accordance with an embodiment.

DETAILED DESCRIPTION

Embodiments discussed herein variously include techniques and/ormechanisms for a bridge device to aid in operation of a packaged devicewith a substrate such as that of a printed circuit board (PCB). A bridgedevice according to one embodiment may enable reduction in a totalnumber interconnect layers in a substrate of a PCB, or other suchdevice, that is to couple to the bridge device. For example, one or moreinterconnect paths of the bridge device may eliminate the need foralternative path structures in a PCB. By providing interconnectstructures at or near a breakout region of a substrate, for example, thesubstrate may allow for at least some breakout routing to be offloadedto the bridge device—e.g., where a path for exchanging a signal, supplyvoltage, reference potential and/or the like is routed from thesubstrate to the bridge and back to the substrate. As a result, certainembodiments, as compared to existing substrate routing techniques, allowfor simpler design of interconnect structures in a breakout region—e.g.,where such designs do not have as significant a tradeoff in terms ofsignal crosstalk.

As used herein, “interconnect” refers to any of a variety of connectionpaths configured to provide for a pass-through exchange between two endsof the interconnect. An interconnect may be configured so that anyconnection of other circuitry (external to the interconnect) to one endof the interconnect via some portion of the interconnect is a connectionto that end via the other end of the interconnect. An interconnect mayinclude only a combination of one or more metal traces, vias or othersuch conductors. However, in some embodiments, an interconnect mayfurther comprise a passive circuit element, such as an alternatingcurrent (AC) coupling capacitor, coupled to the ends of the interconnectby respective conductors of the interconnect.

The technologies described herein may be implemented in one or moreelectronic devices. Non-limiting examples of electronic devices that mayutilize the technologies described herein include any kind of mobiledevice and/or stationary device, such as cameras, cell phones, computerterminals, desktop computers, electronic readers, facsimile machines,kiosks, netbook computers, notebook computers, internet devices, paymentterminals, personal digital assistants, media players and/or recorders,servers (e.g., blade server, rack mount server, combinations thereof,etc.), set-top boxes, smart phones, tablet personal computers,ultra-mobile personal computers, wired telephones, combinations thereof,and the like. Such devices may be portable or stationary. In someembodiments the technologies described herein may be employed in adesktop computer, laptop computer, smart phone, tablet computer, netbookcomputer, notebook computer, personal digital assistant, server,combinations thereof, and the like. More generally, the technologiesdescribed herein may be employed in any of a variety of electronicdevices including integrated circuitry.

FIG. 1 shows an exploded view of a system 100 to enable operation of apackaged integrated circuit device with a substrate according to anembodiment. System 100 is just one example of an embodiment wherein apackaged device may couple to a hardware interface at a first side of asubstrate, wherein a bridge device may couple to a second side of thesubstrate (opposite the first side). In such an embodiment, the bridgedevice may interconnect contacts on the substrate with one another,where one or more contacts of the hardware interface (e.g., only asubset of all such contacts) are also interconnected with the bridgedevice via the second side. As used herein, “contact” may refer to aconductive pad, pin, ball, bump and/or any of various other suchconnection hardware structures.

In the illustrative embodiment of system 100, a PCB 120 has sides 122,124 which are opposite one another. A package 140 may be coupled to PCB120—e.g., where a hardware interface 132 that is disposed at side 122includes contacts to variously couple each to a respective one of othercontacts (not shown) at a side 142 of package 140. PCB 120 may furthercouple to a bridge device 110—e.g., where contacts on a side 112 ofbridge device 110 are coupled each to a respective one of other contacts(not shown) disposed at a side 124 of PCB 120. By way of illustration,contacts of bridge device 110 may include contacts 116, 118—on side112—which are coupled to one another via an interconnect that extends ina substrate of bridge device 110. Different embodiments may be variouslyimplemented, for example, entirely by bridge device 110, entirely by PCB120 or by an assembly including bridge device 110 and PCB 120. Althoughcertain embodiments are not limited in this regard, contact 116 (and/orothers of the one or more contacts) may be disposed in an area 114 ofside 112 that is to be coupled at a location below hardware interface132. Alternatively or in addition, contact 118 may couple to side 124 ata point that is located outside of area 114—e.g., where contact 118 isbelow an area 130 of side 122. Package 140 may overlap only part of area130, in various embodiments.

Bridge device 110 may enable improved routing for connection betweenpackage 140 and interconnect structures (not shown) that variouslyextend in PCB 120. For example, PCB 120 may have interconnects (notshown) variously extending each from a respective one of the pluralityof contacts of hardware interface 132. Such interconnects may eachinclude respective one or more vias and/or one or more conductive traceportions to variously provide coupling of the hardware interface 140 tocircuitry included in or coupled to PCB 120. In an embodiment,interconnects of PCB 120 that are coupled to hardware interface 132 maycouple a subset of the contacts of hardware interface 132 (e.g., only asubset of such contacts) to one or more contacts of bridge device 110.In some embodiments, each contact of hardware interface 132 is coupledvia a respective interconnect of PCB 120 to bridge device 110.Additionally, one or more other interconnects of PCB 120 may bevariously coupled each to a respective contact disposed on side 112.

In an illustrative scenario according to one embodiment, hardwareinterface 132 may include a contact 134 that is coupled by a via (notshown) extending in PCB 120 to another contact (not shown) disposed atside 124. In such an embodiment, the other contact at side 124 mayfacilitate, in combination with bridge device 110, coupling of contact134 to contact 116 and, in turn, to contact 118. Furthermore, connectionof contact 118 to still another contact (not shown) on side 124 mayprovide for coupling of contact 134 to an interconnect of PCB 120 viabridge device 110. Accordingly, bridge device 110 may provideinterconnect paths that are located off of PCB 120, but which providefor bridging between different interconnect structures of PCB 120.

FIG. 2 illustrates elements of a method 200 for providing connectivitywith a bridge device according to an embodiment. Method 200 may includeoperations to assemble or otherwise produce system 100, for example. Inan embodiment, method 200 includes, at 210, coupling a substrate to apackaged device via a hardware interface disposed at a first side of thesubstrate. The coupling at 210 may comprise, for example, soldering orotherwise coupling package 140 to hardware interface 132.

Method 200 may further comprise other operations 220 to provide forcoupling of the packaged device to one or more interconnects of thesubstrate, where such coupling is via a path or paths that includeinterconnect structure of a bridge device (e.g., bridge device 110). Forexample, operations 220 may include, at 230, coupling that, of aplurality of contacts of the hardware interface, couples at least asubset (and in an embodiment, only a subset) of the plurality ofcontacts each to a respective interconnect of the bridge device. The oneor more contacts of the subset may be coupled to the bridge device at230 each via a respective contact at a second side of the substrate. Oneor more other contacts of the hardware interface may (rather than beingcoupled via the second side to the bridge device) instead be coupled,independent of the bridge device, to other circuitry in or on the PCB.In an embodiment, the operations 220 further comprise, at 240, couplinga first one or more contacts disposed at the second side of thesubstrate, via one or more interconnects of the bridge device, each to arespective one of second one or more contacts disposed at the secondside. The coupling at 240 may merely provide for bridging of one or morepairs of contacts that are disposed on the second side of the substrate.

FIG. 3A is a cross-sectional side view of a system 300 provideconnection with a bridge device according to an embodiment. System 300may include one or more features of system 100, for example. In anembodiment, fabrication, assembly and/or other processing to providesystem 300 includes operations of method 200.

In the illustrative embodiment shown, system 300 includes a package 330that is coupled to a PCB 320—e.g., a motherboard—via a hardwareinterface 332 that is disposed at a side 322 (opposite another side 324)of PCB 320. A bridge device 310 may also be coupled to the PCB 320—e.g.,via first one or more contacts 312 and second one or more contacts 316variously disposed at side 324. Such contacts may include pads forsoldering, socket connections and/or any of various other interfacehardware. Although certain embodiments are not limited in this regard,system 300 may further comprise a mounting plate 340, alignment rods342, 344 and/or any of a variety of combinations of other hardware tofasten, secure or otherwise mechanically support coupling of PCB 320,bridge device 340 and package 330 to one another.

Bridge device 310 may couple some or all of the first one or morecontacts 312 each to a respective one of the second one or more contacts316. Two such contacts may be coupled to one another by one or more viasand/or traces extending in a substrate of bridge device 310—e.g., wherethe coupling is independent of any active circuit elements (diodes,transistors, etc.) and/or any passive circuit elements (resistors,capacitors, etc.) that may be included in bridge device 310. By way ofillustration and not limitation, bridge device may include aninterconnect 314, opposite ends of which are variously coupled to thesame side of bridge device 310. Interconnect 314 may include conductivestructures (e.g., including vias and one or more traces) that, whenbridge device 310 is coupled to PCB 320, couple a contact of the one ormore contacts 312 to a contact of the one or more contacts 316. In someembodiments, one or more interconnects each include a respective passivecomponent, such as a coupling capacitor. By providing such bridgingacross a portion of PCB 320—and back to PCB 320—bridge device 310 mayenable improved routing to aid in efficient operation of package 330with PCB 320.

For example, in the illustrative embodiment shown, interconnect 314enables bridging of an interconnect 326 of PCB 320—via contacts 312,316—to another interconnect 328 also of PCB 320. Interconnect 326 mayinclude, for example, a via structure coupling one of the first one ormore contacts 312 to a contact of hardware interface 332. Package 330may have disposed therein or thereon integrated circuitry (notshown)—e.g., including a processor chip, memory chip, system-on-chipand/or the like—that is to exchange with PCB 320 respective ones ofvarious data signals, control signals, clock signals, supply voltages,reference potentials and/or the like. At least some of such exchangesmay be via different respective contacts of hardware interface 332. Insome embodiments, a subset of such exchanges between package 330 and PCB320 are at least in part via bridge device 310, where a different subsetof such exchanges take place independent of any interconnect path ofbridge device. For example, although package device 330 may participatein an exchange with interconnect 328 via interconnect 314, anotherexchange with a different interconnect 327 of PCB 320 may be independentof any interconnect of bridge device 310. Interconnect 327 may becoupled to other circuitry (not shown) in or on PCB 320, where suchcoupling is independent of bridge device 310.

FIG. 3B is a top side view showing an example of bridge device 310,according to one illustrative embodiment. As shown in FIG. 3B, asubstrate of bridge device 310 may have a side 311 on which, or inwhich, is disposed one or more contacts 352 that, for example, areconfigured to variously couple each to a respective one of the first oneor more contacts 312. Alternatively or in addition, one or more othercontacts 356 disposed at side 311 may be configured to variously coupleeach to a respective one of the second one or more contacts 316.

In one embodiment, bridge device 300 is configured to enable alignmentof one or more contacts 352 with one or more contacts 326 in a regionthat is, at least in part, under hardware interface 332. For example,holes 318 extending through the substrate of bridge device 310 may beconfigured to receive alignment rods 342, 344, where the configurationof holes 318 relative to one or more contacts 352 allows for suchalignment using alignment rods 342, 344. In some embodiment, theconfiguration of holes 318 (and/or other structure of bridge device 310)relative to one or more contacts 356 may allow for alignment of one ormore contacts 356 with one or more contacts 316 in a region that is notunder hardware interface 332. For example, one or more contacts 356 maycouple to one or more contacts 316 in a region that is not overlapped bypackage 330.

FIG. 4A is a cross-sectional side view of a system 400 provideconnection with a bridge device according to an embodiment. System 400may include features of system 100—e.g., where assembly and/or otherprocesses to provide system 400 includes operations of method 200.System 400 includes a substrate 420 (e.g., a PCB), where a first side ofthe substrate 420 has disposed thereon a hardware interface 430 a andanother hardware interface 430 b. A packaged IC device 435 a of system400 may be coupled to substrate 420 via hardware interface 430 a, andanother packaged IC device 435 b of system 400 may be coupled viahardware interface 430 a.

Packaged IC devices 435 a, 435 b are merely two examples of devices thatmay be coupled to a substrate that is further coupled to a bridgedevice—such as the illustrative bridge device 410—where such a device isto participate in one or more exchanges (e.g., only a subset of allexchanges) via that bridge device. In the illustrative embodiment shown,bridge device 410 is coupled to an opposite side of substrate 420, andpackaged IC device 435 a overlaps the side of bridge device 410 that iscoupled to substrate 420. One interconnect 422 of substrate 420 extendsfrom hardware interface 430 a through to the opposite side of substrate420. Another interconnect 424 extends from that opposite side ofsubstrate 420 to hardware interface 430 b—e.g., where hardwareinterfaces 430 a, 430 b are coupled to the same side of substrate 420.Still another interconnect 426 disposed in substrate 420 may be coupleddirectly to each of hardware interfaces 430 a, 430 b.

Due at least in part to the configuration shown, coupling of bridgedevice 410 to substrate 420 may result in hardware interface 430 a beingvariously coupled to interconnects that each couple to hardwareinterface 430 b—e.g., wherein, of a plurality of contacts of hardwareinterface 430 a, at least a subset (e.g., only a subset) of suchcontacts is coupled to hardware interface 430 b via bridge device 410.In an embodiment, coupling of bridge device 410 and packaged IC device435 a each to substrate 420 may result in packaged IC device 435 a beingvariously coupled to packaged IC device 435 b via different paths—e.g.,only some of which include interconnect structure of bridge device 410.

FIG. 4B is a cross-sectional side view of a system 450 interconnectdevices according to another embodiment. System 450 may include one ormore features of system 400, for example. In the illustrative embodimentshown, system 450 comprises a substrate 470, hardware interfaces 480 a,480 b and packaged IC devices 485 a, 485 b—e.g., correspondingfunctionally to substrate 420, hardware interfaces 430 a, 430 b andpackaged IC devices 435 a, 435 b, respectively. In addition to packagedIC devices 485 a, 485 b, substrate 470 may be coupled to bridge devices460 a, 460 b. Although substrate 470 is shown as being coupled to eachof packaged IC devices 485 a, 485 b at one side, and to each of bridgedevices 460 a, 460 b at an opposite side, certain embodiments are notlimited with respect to whether or how bridge devices (or circuitrycoupled via some or all such bridge devices) might be variously coupledvia a particular side, or via opposite sides, of a substrate.

In an embodiment, interconnects 472, 478 of substrate 470 extend fromhardware interfaces 480 a, 480 b, respectively, each to the oppositeside of substrate 470. Another interconnect 474 extends between twocontacts (not shown) on that opposite side of substrate 470, where onesuch contact is configured to couple to bridge device 460 a, to theother contact is configured to couple to bridge device 460 b. Stillanother interconnect 476 is coupled directly to each of hardwareinterfaces 480 a, 480 b. Bridge device 460 a may include an interconnect462 a to provide for coupling of interconnects 472, 474 to one another.Similarly, bridge device 460 b may include an interconnect 462 b toprovide for coupling of interconnects 474, 478 to one another. Due inpart to the respective interconnect structures of bridge devices 460 a,460 b, coupling of substrate 470 to bridge devices 460 a, 460 b mayresult in hardware interface 480 a being variously coupled tointerconnects that each couple to hardware interface 480 b—e.g.,wherein, of a plurality of contacts of hardware interface 480 a, asubset of such contacts (and, in an embodiment, only that subset) iscoupled to hardware interface 480 b via one or both of bridge devices460 a, 460 b.

FIG. 5A is a view showing an example of printed circuit board 500,according to one illustrative embodiment. PCB 500 is one example of adevice including a substrate and interface hardware to couple thesubstrate to a packaged IC device and to a bridge device, whereinterconnects variously extending in the substrate allow for connectionof the packaged device with other circuitry via the bridge device. PCB500 may include some or all of the features of PCB 120, for example.

FIG. 5A shows a first side of PCB 500 (e.g., side 124, side 324) atwhich are disposed contacts to couple PCB 500 to a bridge device (notshown). During such coupling, the bridge device may cover an area 520 ofthe first side of PCB 500. At an opposite side (not shown), PCB 500 mayinclude a hardware interface—e.g., including an array of pads, a ballgrid array or other such connection hardware—to couple PCB 500 to apackaged IC device (not shown). The hardware interface may cover an areaof the opposite side that overlaps a corresponding area 510 of the firstside.

One or more contacts in area 510, such as the illustrative contacts 512and contacts 514, may be variously coupled—e.g., by respective viasextending through PCB 500—each to a corresponding contact of thehardware interface. One or more other contacts of the hardware interfacemay not be coupled to any contact in area 520. Coupling the bridgedevice to PCB 500 may provide for connection of the one or more contactsin area 510 (and the corresponding hardware interface contacts) each toanother respective contact that is also disposed at the first side ofPCB 500. For example, the first side may further have disposed thereinor thereon one or more contacts 522 and one or more contacts 524. Someor all of contacts 522, 524 may be located within area 520 but, forexample, outside of area 510. In an embodiment, interconnect structuresof the bridge device variously enable coupling of contacts 512 each to arespective one of contacts 522, and/or coupling of contacts 514 each toa respective one of contacts 524. Lines shown in FIG. 5A variouslyindicate connectivity (provided by such a bridge device) betweencontacts 512 and respective ones of contacts 522, and connectivitysimilarly provided between contacts 514 and respective ones of contacts524.

FIG. 5B shows a first side (e.g., side 124, side 324) of a PCB 550according to another embodiment. PCB 550 may include some or all of thefeatures of PCB 120, for example. Disposed at the first side of PCB 550are contacts to couple PCB 550 to a bridge device—e.g., where, duringsuch coupling, the bridge device covers an area 570 of the first side.An opposite side of PCB 550 (not shown) may include a hardware interfaceto further couple PCB 550 to a packaged IC device. Such a hardwareinterface may cover an area of the opposite side that overlaps acorresponding area 560 of the first side.

One or more contacts in area 560—such as the illustrative contacts 562and contacts 564—may be variously coupled, via interconnects (not shown)in PCB 550, each to a corresponding contact of the hardware interface.One or more other contacts of the hardware interface may not be coupledto any contact in area 570. Coupling the bridge device to PCB 550 mayinclude coupling one or more contacts in area 560 each to a respectivecontact that is also disposed at the first side of PCB 550. For example,interconnect structures of the bridge device may variously enablecoupling of contacts 562 each to a respective one of contacts 572,and/or coupling of contacts 564 each to a respective one of contacts574. Lines shown in FIG. 5B variously indicate connectivity (provided bysuch a bridge device) between contacts 562 and respective ones ofcontacts 572, and connectivity similarly provided between contacts 564and respective ones of contacts 574.

PCB 500 and PCB 550 may, in different embodiments, variously provide forimproved breakout by interconnects that are to facilitate exchanges witha packaged IC device. Such improved breakout of may be provided, forexample, by PCB 500 enabling coupling of contacts 512 to contacts 522(via a bridge device) along a first line, and coupling of contacts 514to contacts 524 (via the bridge device) along a second line that isoblique or perpendicular to the first line. Alternatively or inaddition, improved breakout may be provided by enabling coupling thatchanges a relative pitch between contacts and/or interconnects. Forexample, a relative configuration of contacts 522 to one another may beidentical to a relative configuration of contacts 512 to one another.Alternatively or in addition, a relative configuration of contacts 524to one another may be identical to a relative configuration of contacts514 to one another. By contrast, a pitch of contacts 572 may be greaterthan a pitch of contacts 562 and/or a pitch of contacts 574 may begreater than a pitch of contacts 564.

Certain embodiments are not limited with respect to whetherinterconnects of a bridge device (or, for example, contacts on one ofsides 124, 324) might have a particular configuration relative to oneanother. For example, interconnects of a bridge device according to anembodiment may follow respective paths that have different lengthsand/or extend in different directions—e.g., where some or all of suchinterconnects variously form different rectilinear bends and/ornon-rectilinear bends. Different portions of such interconnects may bevariously parallel, perpendicular or oblique to one another, accordingto various embodiments. In an embodiment, a bridge device includes aplurality of interconnects having respective first ends and respectivesecond ends, wherein a configuration of the first ends is different thana configuration of the second ends relative to each other.

FIG. 6 illustrates a computing device 600 in accordance with oneembodiment. The computing device 600 houses a board 602. The board 602may include a number of components, including but not limited to aprocessor 604 and at least one communication chip 606. The processor 604is physically and electrically coupled to the board 602. In someimplementations the at least one communication chip 606 is alsophysically and electrically coupled to the board 602. In furtherimplementations, the communication chip 606 is part of the processor604.

Depending on its applications, computing device 600 may include othercomponents that may or may not be physically and electrically coupled tothe board 602. These other components include, but are not limited to,volatile memory (e.g., DRAM), non-volatile memory (e.g., ROM), flashmemory, a graphics processor, a digital signal processor, a cryptoprocessor, a chipset, an antenna, a display, a touchscreen display, atouchscreen controller, a battery, an audio codec, a video codec, apower amplifier, a global positioning system (GPS) device, a compass, anaccelerometer, a gyroscope, a speaker, a camera, and a mass storagedevice (such as hard disk drive, compact disk (CD), digital versatiledisk (DVD), and so forth).

The communication chip 606 enables wireless communications for thetransfer of data to and from the computing device 600. The term“wireless” and its derivatives may be used to describe circuits,devices, systems, methods, techniques, communications channels, etc.,that may communicate data through the use of modulated electromagneticradiation through a non-solid medium. The term does not imply that theassociated devices do not contain any wires, although in someembodiments they might not. The communication chip 606 may implement anyof a number of wireless standards or protocols, including but notlimited to Wi-Fi (IEEE 802.11 family), WiMAX (IEEE 802.16 family), IEEE802.20, long term evolution (LTE), Ev-DO, HSPA+, HSDPA+, HSUPA+, EDGE,GSM, GPRS, CDMA, TDMA, DECT, Bluetooth, derivatives thereof, as well asany other wireless protocols that are designated as 3G, 4G, 5G, andbeyond. The computing device 600 may include a plurality ofcommunication chips 606. For instance, a first communication chip 606may be dedicated to shorter range wireless communications such as Wi-Fiand Bluetooth and a second communication chip 606 may be dedicated tolonger range wireless communications such as GPS, EDGE, GPRS, CDMA,WiMAX, LTE, Ev-DO, and others.

The processor 604 of the computing device 600 includes an integratedcircuit die packaged within the processor 604. The term “processor” mayrefer to any device or portion of a device that processes electronicdata from registers and/or memory to transform that electronic data intoother electronic data that may be stored in registers and/or memory. Thecommunication chip 606 also includes an integrated circuit die packagedwithin the communication chip 606.

In various implementations, the computing device 600 may be a laptop, anetbook, a notebook, an ultrabook, a smartphone, a tablet, a personaldigital assistant (PDA), an ultra mobile PC, a mobile phone, a desktopcomputer, a server, a printer, a scanner, a monitor, a set-top box, anentertainment control unit, a digital camera, a portable music player,or a digital video recorder. In further implementations, the computingdevice 600 may be any other electronic device that processes data.

Embodiments may be provided as a computer program product, or software,that may include a machine-readable medium having stored thereoninstructions, which may be used to program a computer system (or otherelectronic devices) to perform a process according to variousembodiments. A machine-readable medium includes any mechanism forstoring or transmitting information in a form readable by a machine(e.g., a computer). For example, a machine-readable (e.g.,computer-readable) medium includes a machine (e.g., a computer) readablestorage medium (e.g., read only memory (“ROM”), random access memory(“RAM”), magnetic disk storage media, optical storage media, flashmemory devices, etc.), a machine (e.g., computer) readable transmissionmedium (electrical, optical, acoustical or other form of propagatedsignals (e.g., infrared signals, digital signals, etc.)), etc.

FIG. 7 illustrates a diagrammatic representation of a machine in theexemplary form of a computer system 700 within which a set ofinstructions, for causing the machine to perform any one or more of themethodologies described herein, may be executed. In alternativeembodiments, the machine may be connected (e.g., networked) to othermachines in a Local Area Network (LAN), an intranet, an extranet, or theInternet. The machine may operate in the capacity of a server or aclient machine in a client-server network environment, or as a peermachine in a peer-to-peer (or distributed) network environment. Themachine may be a personal computer (PC), a tablet PC, a set-top box(STB), a Personal Digital Assistant (PDA), a cellular telephone, a webappliance, a server, a network router, switch or bridge, or any machinecapable of executing a set of instructions (sequential or otherwise)that specify actions to be taken by that machine. Further, while only asingle machine is illustrated, the term “machine” shall also be taken toinclude any collection of machines (e.g., computers) that individuallyor jointly execute a set (or multiple sets) of instructions to performany one or more of the methodologies described herein.

The exemplary computer system 700 includes a processor 702, a mainmemory 704 (e.g., read-only memory (ROM), flash memory, dynamic randomaccess memory (DRAM) such as synchronous DRAM (SDRAM) or Rambus DRAM(RDRAM), etc.), a static memory 706 (e.g., flash memory, static randomaccess memory (SRAM), etc.), and a secondary memory 718 (e.g., a datastorage device), which communicate with each other via a bus 730.

Processor 702 represents one or more general-purpose processing devicessuch as a microprocessor, central processing unit, or the like. Moreparticularly, the processor 702 may be a complex instruction setcomputing (CISC) microprocessor, reduced instruction set computing(RISC) microprocessor, very long instruction word (VLIW) microprocessor,processor implementing other instruction sets, or processorsimplementing a combination of instruction sets. Processor 702 may alsobe one or more special-purpose processing devices such as an applicationspecific integrated circuit (ASIC), a field programmable gate array(FPGA), a digital signal processor (DSP), network processor, or thelike. Processor 702 is configured to execute the processing logic 726for performing the operations described herein.

The computer system 700 may further include a network interface device708. The computer system 700 also may include a video display unit 710(e.g., a liquid crystal display (LCD), a light emitting diode display(LED), or a cathode ray tube (CRT)), an alphanumeric input device 712(e.g., a keyboard), a cursor control device 714 (e.g., a mouse), and asignal generation device 716 (e.g., a speaker).

The secondary memory 718 may include a machine-accessible storage medium(or more specifically a computer-readable storage medium) 732 on whichis stored one or more sets of instructions (e.g., software 722)embodying any one or more of the methodologies or functions describedherein. The software 722 may also reside, completely or at leastpartially, within the main memory 704 and/or within the processor 702during execution thereof by the computer system 700, the main memory 704and the processor 702 also constituting machine-readable storage media.The software 722 may further be transmitted or received over a network720 via the network interface device 708.

While the machine-accessible storage medium 732 is shown in an exemplaryembodiment to be a single medium, the term “machine-readable storagemedium” should be taken to include a single medium or multiple media(e.g., a centralized or distributed database, and/or associated cachesand servers) that store the one or more sets of instructions. The term“machine-readable storage medium” shall also be taken to include anymedium that is capable of storing or encoding a set of instructions forexecution by the machine and that cause the machine to perform any oneor more of the methodologies of an embodiment. The term“machine-readable storage medium” shall accordingly be taken to include,but not be limited to, solid-state memories, and optical and magneticmedia.

FIG. 8 illustrates an interposer 800 that includes one or moreembodiments. The interposer 800 is an intervening substrate used tobridge a first substrate 802 to a second substrate 804. The firstsubstrate 802 may be, for instance, an integrated circuit die. Thesecond substrate 804 may be, for instance, a memory module, a computermotherboard, or another integrated circuit die. Generally, the purposeof an interposer 800 is to spread a connection to a wider pitch or toreroute a connection to a different connection. For example, aninterposer 800 may couple an integrated circuit die to a ball grid array(BGA) 806 that can subsequently be coupled to the second substrate 804.In some embodiments, the first and second substrates 802, 804 areattached to opposing sides of the interposer 800. In other embodiments,the first and second substrates 802, 804 are attached to the same sideof the interposer 800. And in further embodiments, three or moresubstrates are interconnected by way of the interposer 800.

The interposer 800 may be formed of an epoxy resin, afiberglass-reinforced epoxy resin, a ceramic material, or a polymermaterial such as polyimide. In further implementations, the interposermay be formed of alternate rigid or flexible materials that may includethe same materials described above for use in a semiconductor substrate,such as silicon, germanium, and other group III-V and group IVmaterials.

The interposer may include metal interconnects 808 and vias 810,including but not limited to through-silicon vias (TSVs) 812. Theinterposer 800 may further include embedded devices 814, including bothpassive and active devices. Such devices include, but are not limitedto, capacitors, decoupling capacitors, resistors, inductors, fuses,diodes, transformers, sensors, and electrostatic discharge (ESD)devices. More complex devices such as radio-frequency (RF) devices,power amplifiers, power management devices, antennas, arrays, sensors,and MEMS devices may also be formed on the interposer 800. In accordancewith various embodiments, apparatuses or processes disclosed herein maybe used in the fabrication of interposer 800.

FIG. 9 illustrates a computing device 900 in accordance with oneembodiment. The computing device 900 may include a number of components.In one embodiment, these components are attached to one or moremotherboards. In an alternate embodiment, these components arefabricated onto a single system-on-a-chip (SoC) die rather than amotherboard. The components in the computing device 900 include, but arenot limited to, an integrated circuit die 902 and at least onecommunication chip 908. In some implementations the communication chip908 is fabricated as part of the integrated circuit die 902. Theintegrated circuit die 902 may include a CPU 904 as well as on-diememory 906, often used as cache memory, that can be provided bytechnologies such as embedded DRAM (eDRAM) or spin-transfer torquememory (STTM or STTM-RAM).

Computing device 900 may include other components that may or may not bephysically and electrically coupled to the motherboard or fabricatedwithin an SoC die. These other components include, but are not limitedto, volatile memory 910 (e.g., DRAM), non-volatile memory 912 (e.g., ROMor flash memory), a graphics processing unit 914 (GPU), a digital signalprocessor 916, a crypto processor 942 (a specialized processor thatexecutes cryptographic algorithms within hardware), a chipset 920, anantenna 922, a display or a touchscreen display 924, a touchscreencontroller 926, a battery 929 or other power source, a power amplifier(not shown), a global positioning system (GPS) device 928, a compass930, a motion coprocessor or sensors 932 (that may include anaccelerometer, a gyroscope, and a compass), a speaker 934, a camera 936,user input devices 938 (such as a keyboard, mouse, stylus, andtouchpad), and a mass storage device 940 (such as hard disk drive,compact disk (CD), digital versatile disk (DVD), and so forth).

The communications chip 908 enables wireless communications for thetransfer of data to and from the computing device 900. The term“wireless” and its derivatives may be used to describe circuits,devices, systems, methods, techniques, communications channels, etc.,that may communicate data through the use of modulated electromagneticradiation through a non-solid medium. The term does not imply that theassociated devices do not contain any wires, although in someembodiments they might not. The communication chip 908 may implement anyof a number of wireless standards or protocols, including but notlimited to Wi-Fi (IEEE 802.11 family), WiMAX (IEEE 802.16 family), IEEE802.20, long term evolution (LTE), Ev-DO, HSPA+, HSDPA+, HSUPA+, EDGE,GSM, GPRS, CDMA, TDMA, DECT, Bluetooth, derivatives thereof, as well asany other wireless protocols that are designated as 3G, 4G, 5G, andbeyond. The computing device 900 may include a plurality ofcommunication chips 908. For instance, a first communication chip 908may be dedicated to shorter range wireless communications such as Wi-Fiand Bluetooth and a second communication chip 908 may be dedicated tolonger range wireless communications such as GPS, EDGE, GPRS, CDMA,WiMAX, LTE, Ev-DO, and others.

The term “processor” may refer to any device or portion of a device thatprocesses electronic data from registers and/or memory to transform thatelectronic data into other electronic data that may be stored inregisters and/or memory. In various embodiments, the computing device900 may be a laptop computer, a netbook computer, a notebook computer,an ultrabook computer, a smartphone, a tablet, a personal digitalassistant (PDA), an ultra mobile PC, a mobile phone, a desktop computer,a server, a printer, a scanner, a monitor, a set-top box, anentertainment control unit, a digital camera, a portable music player,or a digital video recorder. In further implementations, the computingdevice 900 may be any other electronic device that processes data.

In one implementation, a device comprises a substrate, having disposedtherein first one or more interconnects, a first hardware interfacedisposed at a first side of the substrate, and contacts disposed at asecond side of the substrate, the second side opposite the first side,the contacts including first one or more contacts, wherein the first oneor more interconnects each extend from a respective contact of the firstone or more contacts to a respective contact of the first hardwareinterface, and second one or more contacts. The device is configured tocouple to a first packaged device via the first hardware interface andto a first bridge device via the contacts, wherein the device isconfigured to couple the first one or more contacts each to a respectiveone of the second one or more contacts via one or more interconnects ofthe first bridge device, wherein, of a plurality of contacts of thefirst hardware interface, the device is to couple at least a subset ofthe plurality of contacts to any interconnect of the first bridge devicevia the second side.

In an embodiment, the device further comprises a second hardwareinterface and other contacts, wherein the second hardware interface andthe other contacts are disposed at opposite respective sides of thesubstrate, wherein second interconnects further extend through thesubstrate, the second interconnects including an interconnect coupling afirst one of the other contacts to the second hardware interface, and aninterconnect coupling a second one of the other contacts to the firsthardware interface or to one of the second one or more contacts. Inanother embodiment, the contacts disposed at the second side comprise afirst pair of contacts configured to be couple to one another via thebridge device, the first pair of contacts disposed along a first line,and a second pair of contacts configured to be couple to one another viathe bridge device, the second pair of contacts disposed along a secondline that is oblique or perpendicular to the first line. In anotherembodiment, the contacts include first contacts and second contactsconfigured to be coupled via the bridge device each to a differentrespective one of the first contacts, wherein a pitch of the secondcontacts is larger than a pitch of the first contacts. In anotherembodiment, the first one or more contacts are located in an area of thesecond side that is overlapped by the first hardware interface. Inanother embodiment, the first one or more interconnects includes a viadirectly coupled both to a contact of the hardware interface and to oneof the first one or more contacts. In another embodiment, the second oneor more contacts are located in another area of the second side otherthan any area that is overlapped by the first hardware interface. Inanother embodiment, the device is a printed circuit board.

In another implementation, a bridge device comprises a first substratehaving disposed therein first one or more interconnects, and contactsconfigured to couple the bridge device to a first side of a secondsubstrate, the contacts including first one or more contacts and secondone or more contacts each disposed on a side of the first substrate,wherein the first one or more interconnects each couple a respective oneof the first one or more contacts to a respective one of the second oneor more contacts. The first one or more contacts are configured tocouple the bridge device, via one or more interconnects extendingthrough the second substrate, to a hardware interface at the second sideof the second substrate, the second side opposite the first side,wherein, of a plurality of contacts of the hardware interface, thebridge device is configured to couple to at least a subset of theplurality of contacts via the side of the substrate.

In an embodiment, the first substrate forms holes each to receive arespective hardware to align the bridge device with the secondsubstrate. In another embodiment, the contacts comprise a first pair ofcontacts coupled to one another, the first pair of contacts disposedalong a first line, and a second pair of contacts coupled to oneanother, the second pair of contacts disposed along a second line thatis oblique or perpendicular to the first line. In another embodiment,the contacts include first contacts and second contacts each coupled toa different respective one of the first contacts, wherein a pitch of thesecond contacts is larger than a pitch of the first contacts. In anotherembodiment, the first one or more contacts are to couple to the secondsubstrate at a location that is overlapped by the hardware interface. Inanother embodiment, the second one or more contacts are to couple to thesecond substrate at a location other than any that is overlapped by thefirst hardware interface.

In another implementation, a method comprises coupling a substrate to afirst packaged device via a first hardware interface disposed at a firstside of the substrate, and coupling the substrate to a first bridgedevice via contacts disposed at a second side of the substrate, thesecond side opposite the first side, including coupling first one ormore of the contacts each to a respective one of second one or more ofthe contacts via one or more interconnects of the first bridge device.Of a plurality of contacts of the first hardware interface, coupling thesubstrate to the first packaged device and to the bride device couplesat least a subset of the plurality of contacts to any interconnect ofthe first bridge device via the second side.

In an embodiment, the method further comprises coupling the substrate toa second packaged device via a second hardware interface, wherein thesecond hardware interface and the other contacts are disposed atopposite respective sides of the substrate, and coupling the substrateto a second bridge device via the other contacts, wherein secondinterconnects further extend through the substrate, the secondinterconnects including an interconnect coupling a first one of theother contacts to the second hardware interface, and an interconnectcoupling a second one of the other contacts to the first hardwareinterface or to one of the second one or more contacts. In anotherembodiment, the contacts disposed at the second side comprise a firstpair of contacts disposed along a first line, and a second pair ofcontacts disposed along a second line that is oblique or perpendicularto the first line, and wherein coupling the substrate to a first bridgedevice comprises coupling the first pair of contacts to one another viathe bridge device, and coupling the second pair of contacts to oneanother via the bridge device.

In another embodiment, the contacts disposed at the second side includefirst contacts and second contacts, wherein coupling the substrate to afirst bridge device includes coupling the first contacts each to adifferent respective one of the second contacts, wherein a pitch of thesecond contacts is larger than a pitch of the first contacts. In anotherembodiment, the first one or more contacts are located in an area of thesecond side that is overlapped by the first hardware interface. Inanother embodiment, the first one or more interconnects includes a viadirectly coupled both to a contact of the hardware interface and to oneof the first one or more contacts. In another embodiment, the second oneor more contacts are located in another area of the second side otherthan any area that is overlapped by the first hardware interface.

In another implementation, a system comprises a first packaged deviceand a printed circuit board including a substrate having disposedtherein a first interconnect, a first hardware interface disposed at afirst side of the substrate, wherein the first packaged device iscoupled to the printed circuit board via the first hardware interface.The printed circuit board further comprises contacts disposed at asecond side of the substrate, the second side opposite the first side,the contacts including a first contact, wherein the first interconnectcouples the first contact to a contact of the first hardware interface,and a second contact. The system further comprises a first bridge devicecoupled to the printed circuit board via the contacts, wherein aninterconnect of the first bridge device is coupled to the first contactand the second contact, and wherein, of a plurality of contacts of thefirst hardware interface, the printed circuit board couples at least asubset of the plurality of contacts to any interconnect of the firstbridge device via the second side.

In an embodiment, the printed circuit board further comprises a secondhardware interface and other contacts, wherein the second hardwareinterface and the other contacts are disposed at opposite respectivesides of the substrate, wherein second interconnects further extendthrough the substrate, the second interconnects including aninterconnect coupling a first one of the other contacts to the secondhardware interface, and an interconnect coupling a second one of theother contacts to the first hardware interface or to one of the secondcontact. In another embodiment, the contacts disposed at the second sidecomprise a first pair of contacts coupled to one another via the bridgedevice, the first pair of contacts disposed along a first line, and asecond pair of contacts coupled to one another via the bridge device,the second pair of contacts disposed along a second line that is obliqueor perpendicular to the first line. In another embodiment, the contactsinclude first contacts and second contacts coupled via the bridge deviceeach to a different respective one of the first contacts, wherein apitch of the second contacts is larger than a pitch of the firstcontacts. In another embodiment, the first contact is located in an areaof the second side that is overlapped by the first hardware interface.In another embodiment, the first interconnect includes a via directlycoupled both to a contact of the hardware interface and to the firstcontact. In another embodiment, the second contact is located in anotherarea of the second side other than any area that is overlapped by thefirst hardware interface.

Techniques and architectures for interconnecting circuit devices aredescribed herein. In the above description, for purposes of explanation,numerous specific details are set forth in order to provide a thoroughunderstanding of certain embodiments. It will be apparent, however, toone skilled in the art that certain embodiments can be practiced withoutthese specific details. In other instances, structures and devices areshown in block diagram form in order to avoid obscuring the description.

Reference in the specification to “one embodiment” or “an embodiment”means that a particular feature, structure, or characteristic describedin connection with the embodiment is included in at least one embodimentof the invention. The appearances of the phrase “in one embodiment” invarious places in the specification are not necessarily all referring tothe same embodiment.

Some portions of the detailed description herein are presented in termsof algorithms and symbolic representations of operations on data bitswithin a computer memory. These algorithmic descriptions andrepresentations are the means used by those skilled in the computingarts to most effectively convey the substance of their work to othersskilled in the art. An algorithm is here, and generally, conceived to bea self-consistent sequence of steps leading to a desired result. Thesteps are those requiring physical manipulations of physical quantities.Usually, though not necessarily, these quantities take the form ofelectrical or magnetic signals capable of being stored, transferred,combined, compared, and otherwise manipulated. It has proven convenientat times, principally for reasons of common usage, to refer to thesesignals as bits, values, elements, symbols, characters, terms, numbers,or the like.

It should be borne in mind, however, that all of these and similar termsare to be associated with the appropriate physical quantities and aremerely convenient labels applied to these quantities. Unlessspecifically stated otherwise as apparent from the discussion herein, itis appreciated that throughout the description, discussions utilizingterms such as “processing” or “computing” or “calculating” or“determining” or “displaying” or the like, refer to the action andprocesses of a computer system, or similar electronic computing device,that manipulates and transforms data represented as physical(electronic) quantities within the computer system's registers andmemories into other data similarly represented as physical quantitieswithin the computer system memories or registers or other suchinformation storage, transmission or display devices.

Certain embodiments also relate to apparatus for performing theoperations herein. This apparatus may be specially constructed for therequired purposes, or it may comprise a general purpose computerselectively activated or reconfigured by a computer program stored inthe computer. Such a computer program may be stored in a computerreadable storage medium, such as, but is not limited to, any type ofdisk including floppy disks, optical disks, CD-ROMs, andmagnetic-optical disks, read-only memories (ROMs), random accessmemories (RAMs) such as dynamic RAM (DRAM), EPROMs, EEPROMs, magnetic oroptical cards, or any type of media suitable for storing electronicinstructions, and coupled to a computer system bus.

The algorithms and displays presented herein are not inherently relatedto any particular computer or other apparatus. Various general purposesystems may be used with programs in accordance with the teachingsherein, or it may prove convenient to construct more specializedapparatus to perform the required method steps. The required structurefor a variety of these systems will appear from the description herein.In addition, certain embodiments are not described with reference to anyparticular programming language. It will be appreciated that a varietyof programming languages may be used to implement the teachings of suchembodiments as described herein.

Besides what is described herein, various modifications may be made tothe disclosed embodiments and implementations thereof without departingfrom their scope. Therefore, the illustrations and examples hereinshould be construed in an illustrative, and not a restrictive sense. Thescope of the invention should be measured solely by reference to theclaims that follow.

What is claimed is:
 1. A device comprising: a substrate having disposedtherein first one or more interconnects; a first hardware interfacedisposed at a first side of the substrate; contacts disposed at a secondside of the substrate, the second side opposite the first side, thecontacts including: first one or more contacts, wherein the first one ormore interconnects each extend from a respective contact of the firstone or more contacts to a respective contact of the first hardwareinterface; and second one or more contacts; wherein the device isconfigured to couple to a first packaged device via the first hardwareinterface and to a first bridge device via the contacts, wherein thedevice is configured to couple the first one or more contacts each to arespective one of the second one or more contacts via one or moreinterconnects of the first bridge device, and wherein, of a plurality ofcontacts of the first hardware interface, the device is to couple atleast a subset of the plurality of contacts to any interconnect of thefirst bridge device via the second side.
 2. The device of claim 1,further comprising a second hardware interface and other contacts,wherein the second hardware interface and the other contacts aredisposed at opposite respective sides of the substrate, wherein secondinterconnects further extend through the substrate, the secondinterconnects including: an interconnect coupling a first one of theother contacts to the second hardware interface; and an interconnectcoupling a second one of the other contacts to the first hardwareinterface or to one of the second one or more contacts.
 3. The device ofclaim 1, wherein the contacts disposed at the second side comprise: afirst pair of contacts configured to be couple to one another via thebridge device, the first pair of contacts disposed along a first line;and a second pair of contacts configured to be couple to one another viathe bridge device, the second pair of contacts disposed along a secondline that is oblique or perpendicular to the first line.
 4. The deviceof claim 1, wherein the contacts include: first contacts; and secondcontacts configured to be coupled via the bridge device each to adifferent respective one of the first contacts, wherein a pitch of thesecond contacts is larger than a pitch of the first contacts.
 5. Thedevice of claim 1, wherein the first one or more contacts are located inan area of the second side that is overlapped by the first hardwareinterface.
 6. The device of claim 5, wherein the first one or moreinterconnects includes a via directly coupled both to a contact of thehardware interface and to one of the first one or more contacts.
 7. Thedevice of claim 5, wherein the second one or more contacts are locatedin another area of the second side other than any area that isoverlapped by the first hardware interface.
 8. The device of claim 1,wherein the device is a printed circuit board.
 9. A bridge devicecomprising: a first substrate having disposed therein first one or moreinterconnects; and contacts configured to couple the bridge device to afirst side of a second substrate, the contacts including first one ormore contacts and second one or more contacts each disposed on a side ofthe first substrate; wherein the first one or more interconnects eachcouple a respective one of the first one or more contacts to arespective one of the second one or more contacts; wherein the first oneor more contacts are configured to couple the bridge device, via one ormore interconnects extending through the second substrate, to a hardwareinterface at the second side of the second substrate, the second sideopposite the first side; and wherein, of a plurality of contacts of thehardware interface, the bridge device is configured to couple to atleast a subset of the plurality of contacts via the side of thesubstrate.
 10. The bridge device of claim 9, wherein the first substrateforms holes each to receive a respective hardware to align the bridgedevice with the second substrate.
 11. The bridge device of claim 9,wherein the contacts comprise: a first pair of contacts coupled to oneanother, the first pair of contacts disposed along a first line; and asecond pair of contacts coupled to one another, the second pair ofcontacts disposed along a second line that is oblique or perpendicularto the first line.
 12. The bridge device of claim 9, wherein thecontacts include first contacts and second contacts each coupled to adifferent respective one of the first contacts, wherein a pitch of thesecond contacts is larger than a pitch of the first contacts.
 13. Thebridge device of claim 9, wherein the first one or more contacts are tocouple to the second substrate at a location that is overlapped by thehardware interface.
 14. The bridge device of claim 13, wherein thesecond one or more contacts are to couple to the second substrate at alocation other than any that is overlapped by the first hardwareinterface.
 15. A method comprising: coupling a substrate to a firstpackaged device via a first hardware interface disposed at a first sideof the substrate; and coupling the substrate to a first bridge devicevia contacts disposed at a second side of the substrate, the second sideopposite the first side, including coupling first one or more of thecontacts each to a respective one of second one or more of the contactsvia one or more interconnects of the first bridge device; wherein, of aplurality of contacts of the first hardware interface, coupling thesubstrate to the first packaged device and to the bride device couplesat least a subset of the plurality of contacts to any interconnect ofthe first bridge device via the second side.
 16. The method of claim 15,further comprising: coupling the substrate to a second packaged devicevia a second hardware interface, wherein the second hardware interfaceand the other contacts are disposed at opposite respective sides of thesubstrate; and coupling the substrate to a second bridge device via theother contacts, wherein second interconnects further extend through thesubstrate, the second interconnects including: an interconnect couplinga first one of the other contacts to the second hardware interface; andan interconnect coupling a second one of the other contacts to the firsthardware interface or to one of the second one or more contacts.
 17. Themethod of claim 15, wherein the contacts disposed at the second sidecomprise: a first pair of contacts disposed along a first line; and asecond pair of contacts disposed along a second line that is oblique orperpendicular to the first line; and wherein coupling the substrate to afirst bridge device comprises: and coupling the first pair of contactsto one another via the bridge device; and coupling the second pair ofcontacts to one another via the bridge device.
 18. The method of claim15, wherein the contacts disposed at the second side include firstcontacts and second contacts, wherein coupling the substrate to a firstbridge device includes coupling the first contacts each to a differentrespective one of the second contacts, wherein a pitch of the secondcontacts is larger than a pitch of the first contacts.
 19. A systemcomprising: a first packaged device; a printed circuit board including;a substrate having disposed therein a first interconnect; a firsthardware interface disposed at a first side of the substrate, whereinthe first packaged device is coupled to the printed circuit board viathe first hardware interface; contacts disposed at a second side of thesubstrate, the second side opposite the first side, the contactsincluding: a first contact, wherein the first interconnect couples thefirst contact to a contact of the first hardware interface; and a secondcontact; a first bridge device coupled to the printed circuit board viathe contacts, wherein an interconnect of the first bridge device iscoupled to the first contact and the second contact, and wherein, of aplurality of contacts of the first hardware interface, the printedcircuit board couples at least a subset of the plurality of contacts toany interconnect of the first bridge device via the second side.
 20. Thesystem of claim 19, the printed circuit board further comprising asecond hardware interface and other contacts, wherein the secondhardware interface and the other contacts are disposed at oppositerespective sides of the substrate, wherein second interconnects furtherextend through the substrate, the second interconnects including: aninterconnect coupling a first one of the other contacts to the secondhardware interface; and an interconnect coupling a second one of theother contacts to the first hardware interface or to one of the secondcontact.
 21. The system of claim 19, wherein the contacts disposed atthe second side comprise: a first pair of contacts coupled to oneanother via the bridge device, the first pair of contacts disposed alonga first line; and a second pair of contacts coupled to one another viathe bridge device, the second pair of contacts disposed along a secondline that is oblique or perpendicular to the first line.
 22. The systemof claim 19, wherein the contacts include: first contacts; and secondcontacts coupled via the bridge device each to a different respectiveone of the first contacts, wherein a pitch of the second contacts islarger than a pitch of the first contacts.